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C1006_X5R_SMD • 2/29/2016

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

EIA

Size

Code

Metric

Size

Code

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0201

0603

0.38

0.56

0.52

1.80

1.00

0.33

0.46

0.42

1.50

0.80

0.28

0.36

0.32

1.20

0.60

0402

1005

0.50

0.72

0.72

2.20

1.20

0.45

0.62

0.62

1.90

1.00

0.40

0.52

0.52

1.60

0.80

0603

1608

0.90

1.15

1.10

4.00

2.10

0.80

0.95

1.00

3.10

1.50

0.60

0.75

0.90

2.40

1.20

0805

2012

1.00

1.35

1.55

4.40

2.60

0.90

1.15

1.45

3.50

2.00

0.75

0.95

1.35

2.80

1.70

1206

3216

1.60

1.35

1.90

5.60

2.90

1.50

1.15

1.80

4.70

2.30

1.40

0.95

1.70

4.00

2.00

1210

3225

1.60

1.35

2.80

5.65

3.80

1.50

1.15

2.70

4.70

3.20

1.40

0.95

2.60

4.00

2.90

3225

1.50

1.60

2.90

5.60

3.90

1.40

1.40

2.80

4.70

3.30

1.30

1.20

2.70

4.00

3.00

1

Only for capacitance values ≥ 22 µF

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

Y

C

C

X

X

V1

V2

Grid Placement Courtyard

Y