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SG-BGA-6003 Datasheet(PDF) 2 Page - Ironwood Electronics. |
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SG-BGA-6003 Datasheet(HTML) 2 Page - Ironwood Electronics. |
2 / 3 page Status: Released Drawing: Meghann Fedde Scale: 3:1 Rev: G Date: 8/15/01 File: SG-BGA-6003 Dwg.mcd SG-BGA-6003 Drawing © 2001 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Modified: 6/2/09 PAGE 2 of 3 Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Recommended PCB Layout Top View Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application *Note: BGA pattern is not symmetrical with respect to the mounting holes. R 1 2 R 1 2 R 1 Socket Body Size Alignment Hole Orientation Mark 1.25mm±0.125mm(x4) 1.25mm±0.125mm(x4) 5.08mm 19.225mm±0.125mm(x4) 16.725mm(x4) Ø 0.85mm±0.025mm (x2) Ø 0.36mmPAD 2.36mm 2.74mm* 2.54mm Mounting Hole Ø 1.61mm±0.05mm(x4) 0.8mm typ. 12mm 11.95mm |
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