PC740A datasheet(31/44 Pages) MOTOROLA

Part #	PC740A

Description	MPC750A RISC Microprocessor Hardware Specifications

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Manufacturer	MOTOROLA [Motorola, Inc]

Direct Link	http://www.freescale.com

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MPC750A RISC Microprocessor Hardware Speciﬁcations

31

System Design Information

1.7.4 Mechanical Dimensions of the MPC750

Figure 17 provides the mechanical dimensions and bottom surface nomenclature of the MPC750, 360

CBGA package.

Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC750

1.8 System Design Information

This section provides electrical and thermal design recommendations for successful application of the

MPC750.

DIM

MIN

MAX

MILLIMETERS

A

2.72

3.20

A1

0.80

1.00

A2

1.10

1.30

A3

---

0.60

A4

0.82

0.90

b

D

25.00 BSC

D1

22.86 BSC

D2

---

12.50

D3

2.75

---

D4

6.00

9.00

e

1.27 BSC

E

25.00 BSC

E1

22.86 BSC

E2

---

14.30

E3

3.00

---

E4

8.00

11.00

NOTES:

1.

DIMENSIONS AND TOLERANCING PER ASME

Y14.5M, 1994.

2.

DIMENSIONS IN MILLIMETERS.

3.

DIMENSION b IS THE MAXIMUM SOLDER BALL

DIAMETER MEASURED PARALLEL TO DATUM A.

4.

D2AND E2 DEFINE THEAREA OCCUPIED BY THE

DIE AND UNDERFILL. ACTUAL SIZE OF THIS

AREA MAY BE SMALLER THAN SHOWN. D3 AND

E3 ARE THE MINIMUM CLEARANCE FROM THE

PACKAGE EDGE TO THE CHIP CAPACITORS.

5.

CAPACITORS MAY NOT BE PRESENT ON ALL

DEVICES.

6.

CAUTION MUST BE TAKEN NOT TO SHORT

EXPOSED METAL CAPACITOR PADS ON

PACKAGE TOP.

0.3 A

0.15 A

0.25 A

C

L

A

D

E

C

E4

E2

B

PIN A1

INDEX

2X

D4

D2

D3

2X

E3

TOP VIEW

18X

2X

0.2

2X

0.35 A

0.15 A

B C

0.82

0.93

BOTTOM VIEW

W

V

U

T

R

P

N

M

L

K

J

H

G

F

E

D

C

B

A

123456789 10111213141516171819

C

L

SIDE VIEW

A

D1

E1

360X

b

e

18X

e

A1

A2

A3

A4

360X

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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