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LM5165YQDGSTQ1 Datasheet(PDF) 5 Page - Texas Instruments |
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LM5165YQDGSTQ1 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 47 page 5 LM5165-Q1 www.ti.com SNVSAJ3A – MARCH 2016 – REVISED MARCH 2016 Product Folder Links: LM5165-Q1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Fixed output versions. (4) Adjustable output version. (5) High junction temperatures degrade operating lifetime. Operating lifetime is derated for junction temperatures greater than 125°C. 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) Over the recommended operating junction temperature range of –40°C to 150°C (unless otherwise noted). (1) PARAMETER MIN MAX UNIT VIN to GND –0.3 68 V EN to GND –0.3 VIN + 0.3 SW to GND –0.7 VIN + 0.3 20-ns transient –3 PGOOD, VOUT(3) to GND Survives short to automotive battery voltage –0.3 16 HYS to GND –0.3 7 ILIM, SS, RT, FB(4) to GND –0.3 3.6 TJ Maximum junction temperature(5) –40 150 °C Tstg Storage temperature range –55 150 °C (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. (2) Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. (3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT VESD Electrostatic discharge Human body model (HBM), per AEC Q100-002(1)(2) ±2000 V Charged device model (CDM), per AEC Q100-011(3) Corner pins (SW, RT, PGOOD, GND) ±750 Other pins ±500 |
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