4.8225±0.0250

2.2825±0.0250

17.4750

Socket Base Outline

19.7250

Backing Plate Oultine

7.4875±0.0350 (x8)

10.50

5.1250±0.0250*

5.2500±0.0250

1.70±0.10 (x4)

Non Plated Hole

0.85 (x2)

Non Plated Hole

0.50 Typ.

0.28

18.325 Bottom Guide

18.075

Bottom

Guide

Target PCB Recommendations

Total thickness: 1.6mm min.

Plating: Gold or Solder finish

PCB Pad height: Same or higher than solder mask

*Note: BGA pattern is not symmetrical

with respect to the mounting holes.

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance

±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change

without notice.

Description: Recommended PCB Layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. G

DATE: 11/12/10

Material: Material <not specified>

Finish:

Weight: 13.02

SBT-BGA-7000 Drawing

SCALE: 5:1

SHEET: 2 OF 5

ENG: V. Panavala

FILE: SBT-BGA-7000

DRAWN BY: V. Panavala