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RP114Q202B-TR-FE Datasheet(PDF) 8 Page - RICOH electronics devices division |
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RP114Q202B-TR-FE Datasheet(HTML) 8 Page - RICOH electronics devices division |
8 / 28 page RP114x NO. EA-236-160824 8 PACKAGE INFORMATION Power Dissipation (DFN(PLP)1010-4) Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the Measurement Conditions below. Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind Velocity=0m/s) Board Material Glass Cloth Epoxy Plastic (Double-sided) Board Dimensions 40mm x 40mm x 1.6mm Copper Ratio Top-side: Approx. 50%, Back-side: Approx. 50% Through-hole φ 0.54mm x 24pcs Measurement Result (Ta=25 °C) Standard Land Pattern Power Dissipation 400mW (Tjmax=125 °C) 500mW (Tjmax=150 °C) Thermal Resistance θja=(125-25°C)/0.4W=250 °C/W θjc=67 °C/W Note: The above graph shows the power dissipation of the package based on Tjmax=125ºC and Tjmax=150ºC. Operating the IC within the shaded area in the graph might have an influence on its lifetime. Operating time must be within the time limit described in the table below. Operating Time Estimated Years (Operating 4 hrs/ day) 13,000 hours 9 Years 40 Measurement Board Pattern IC Mount Area (Unit: mm) |
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