139x

0.26 pad

2x 3.0226±0.125

keep out area on target PCB

2x

0.85±0.025

4 1.70±0.10 drill thru

0

center of the

BGA array

2.80

2.80

4.1125

6.6125

6.8625

6.6125

6.8625

5.3625

4.8693

3.8625

3.9625

3.30

3.30

4.1125

4.1125

backing plate

1.0mm tall component

clearance area

Pin A1

Pin A15

Target PCB Recommendations

Total thickness: 1.0mm min.

Plating: Gold or Solder finish

PCB Pad height: Same or higher than solder mask

*Note: BGA pattern is not symmetrical

with respect to the mounting holes.

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance

±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change

without notice.

Description: Recommended Layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 7/17/2014

Material: Material <not specified>

Finish:

Weight: 4.51

SBT-BGA-7020 Drawing

SCALE: 7:1

SHEET: 2 OF 5

ENG: E. Smolentseva

FILE: SBT-BGA-7020 Dwg

DRAWN BY: M. Raske