D

E

0.15 Z (x2)

Y

X

C

e

b

D1

E1

Pin 1

A2

A

A1

DETAIL C

SCALE 16 : 1

0.08 Z

0.10 Z

Z

1. Dimensions are in millimeters.

2. Interpret dimensions and tolerances per ASME Y14.5M-1994.

3. Dimension b is measured at the maximum solder ball diameter, parallel to

datum plane Z.

4. Datum Z (seating plane) is defined by the spherical crowns of the solder

balls.

Array: 23x23

Ironwood Package code: BGA361H

DIM

Minimum

NOM

Maximum

A

-

1.2

A1

0.18

0.23

0.28

A2

0.84

0.89

0.94

b

0.25

0.30

0.35

D

11.90

12.00

12.10

D1

11.00

E

11.90

12.00

12.10

E1

11.00

e

0.5 BSC

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance

±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change

without notice.

Description: BGA

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. B

DATE: 02/19/2014

Material: N/A

Finish: N/A

Weight: 13.37

SBT-BGA-7018 Drawing

SCALE: 5:1

SHEET: 3 OF 5

ENG: S. Huang

FILE: SBT-BGA-7018 Dwg

DRAWN BY: M. Raske