TS80C186EB20 datasheet(22/59 Pages) INTEL

Part #	TS80C186EB20

Description	16-BIT HIGH-INTEGRATION EMBEDDED PROCESSORS

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Manufacturer	INTEL [Intel Corporation]

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80C186EB80C188EB 80L186EB80L188EB

PACKAGE THERMAL

SPECIFICATIONS

The 80C186EB80L186EB is specified for operation

when TC (the case temperature) is within the range

of b40 Cto a100 C (PLCC package) or b40 Cto

a

114 C (QFP package) TC may be measured in

any environment to determine whether the proces-

sor is within the specified operating range The case

temperature must be measured at the center of the

top surface

TA (the ambient temperature) can be calculated

from iCA (thermal resistance from the case to ambi-

ent) with the following equation

TA e TC b P iCA

Typical values for iCA at various airflows are given

in Table 10 P (the maximum power consumption

specified in watts) is calculated by using the maxi-

mum ICC as tabulated in the DC specifications and

VCC of 55V

Table 10 Thermal Resistance (iCA) at Various Airflows (in CWatt)

Airflow Linear ftmin (msec)

0

200

400

600

800

1000

(0) (101) (203) (304) (406) (507)

iCA (PLCC)

30

24

21

19

17

165

iCA (QFP)

58

47

43

40

38

36

iCA (SQFP)

70

TBD

22

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