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MAX17245ETESB+ Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX17245ETESB+ Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 17 page TQFN Junction-to-Ambient Thermal Resistance (BJA)...........35ºC/W Junction-to-Case Thermal Resistance (BJC) ..............2.7ºC/W TSSOP Junction-to-Ambient Thermal Resistance (BJA)........38.3ºC/W Junction-to-Case Thermal Resistance (BJC) .................3ºC/W *As per JEDEC51 standard (multilayer board). SUP, SUPSW, EN to PGND..................................-0.3V to +42V LX (Note 1)............................................................-0.3V to +42V SUP to SUPSW....................................................-0.3V to +0.3V BIAS to AGND.........................................................-0.3V to +6V SYNCOUT, FOSC, COMP, FSYNC, PGOOD, FB to AGND ........................-0.3V to (VBIAS + 0.3V) OUT to PGND .......................................................-0.3V to +12V BST to LX (Note 1)..................................................-0.3V to +6V AGND to PGND...................................................-0.3V to + 0.3V LX Continuous RMS Current................................................3.5A Output Short-Circuit Duration....................................Continuous Continuous Power Dissipation (TA = +70°C)* TQFN (derate 28.6mW/ºC above +70°C)...............2285.7mW TSSOP (derate 26.1mW/ºC above +70°C) ............2088.8mW Operating Temperature Range....................... -40°C to +85°C Junction Temperature......................................................+150°C Storage Temperature Range............................ -65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow).......................................+260°C (VSUP = VSUPSW = 14V, VEN = 14V, L1 = 2.2µH, CIN = 4.7µF, COUT = 22µF, CBIAS = 1µF, CBST = 0.1µF, RFOSC = 12kΩ, TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage VSUP, VSUPSW 3.5 36 V Line Transient Event Supply Voltage VSUP_t_LT tt_LT < 1s 42 V Supply Current ISUP_STANDBY Standby mode, no load, VOUT = 5V, VFSYNC = 0V 28 40 µA Standby mode, no load, VOUT = 3.3V, VFSYNC = 0V 22 35 Shutdown Supply Current ISHDN VEN = 0V 5 10 µA BIAS Regulator Voltage VBIAS VSUP = VSUPSW = 6V to 42V, IBIAS = 0 to 10mA 4.7 5 5.4 V BIAS Undervoltage Lockout VUVBIAS VBIAS rising 2.95 3.15 3.40 V BIAS Undervoltage Lockout Hysteresis 450 650 mV Thermal Shutdown Threshold +175 °C Thermal Shutdown Threshold Hysteresis 15 °C Package Thermal Characteristics (Note 2) Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: Self-protected against transient voltages exceeding these limits for ≤ 50ns under normal operation and loads up to the maximum rated output current. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics www.maximintegrated.com Maxim Integrated │ 2 MAX17245 3.5V–36V, 3.5A, Synchronous Buck Converter With 28μA Quiescent Current and Reduced EMI |
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