POWER DISSIPATION

SOT-89-5

Ver. A

i

The following conditions are used in this measurement.

Measurement Conditions

High Wattage Land Pattern

Standard Land Pattern

Environment

Mounting on Board (Wind Velocity = 0 m/s) Mounting on Board (Wind Velocity = 0 m/s)

Board Material

Glass Cloth Epoxy Plastic (Double-sided)

Glass Cloth Epoxy Plastic (Double-sided)

Board Dimensions

30 mm x 30 mm x 1.6 mm

50 mm x 50 mm x 1.6 mm

Copper Ratio

Top-side: Approx. 20%,

Back-side: Approx. 100%

Top-side: Approx. 10%,

Back-side: Approx. 100%

Through-hole

0.85 mm x 10 pcs

-

Measurement Result

(Ta = 25

C, Tjmax = 125C)

High Wattage Land Pattern

Standard Land Pattern

Free Air

Power Dissipation

1300 mW

900 mW

500 mW

Thermal Resistance

77ºC/W

111ºC/W

200ºC/W

Power Dissipation (mW) vs. Temperature (

°C)

Measurement Board Pattern

0

100

200

300

400

500

600

700

800

900

1000

1100

1200

1300

1400

1500

0

25

50

75

100

125

150

Ambient Temperature (°C)

105

Free Air

On Board

(Standard Land Pattern)

On Board

(High Wattage Land Pattern)

30

7.5

15

50

High Wattage

Standard

IC Mount Area (Unit: mm)