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MCM69F737 Datasheet(PDF) 7 Page - Motorola, Inc

Part No. MCM69F737
Description  128K x 36 Bit Flow?밫hrough BurstRAM Synchronous Fast Static RAM
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Manufacturer  MOTOROLA [Motorola, Inc]
Direct Link  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MCM69F737 Datasheet(HTML) 7 Page - Motorola, Inc

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MCM69F737
7
MOTOROLA FAST SRAM
ABSOLUTE MAXIMUM RATINGS (See Note 1)
Rating
Symbol
Value
Unit
Notes
Power Supply Voltage
VDD
VSS – 0.5 to + 4.6
V
I/O Supply Voltage
VDDQ
VSS – 0.5 to VDD
V
2
Input Voltage Relative to VSS for
Any Pin Except VDD
Vin, Vout
VSS – 0.5 to
VDD + 0.5
V
2
Input Voltage (Three–State I/O)
VIT
VSS – 0.5 to
VDDQ + 0.5
V
2
Output Current (per I/O)
Iout
± 20
mA
Package Power Dissipation
PD
1.6
W
3
Ambient Temperature
TA
0 to 70
°C
Die Temperature
TJ
110
°C
3
Temperature Under Bias
Tbias
– 10 to 85
°C
Storage Temperature
Tstg
– 55 to 125
°C
NOTES:
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.
2. This is a steady–state DC parameter that is in effect after the power supply has
achieved its nominal operating level. Power sequencing is not necessary.
3. Power dissipation capability is dependent upon package characteristics and use
environment. See Package Thermal Characteristics.
PACKAGE THERMAL CHARACTERISTICS — PBGA
Rating
Symbol
Max
Unit
Notes
Junction to Ambient (@ 200 lfm)
Single Layer Board
Four Layer Board
R
θJA
38
22
°C/W
1, 2
Junction to Board (Bottom)
R
θJB
14
°C/W
3
Junction to Case (Top)
R
θJC
5
°C/W
4
NOTES:
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, board population, and board thermal resistance.
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883 Method 1012.1).
PACKAGE THERMAL CHARACTERISTICS — TQFP
Rating
Symbol
Max
Unit
Notes
Junction to Ambient (@ 200 lfm)
Single Layer Board
Four Layer Board
R
θJA
40
25
°C/W
1, 2
Junction to Board (Bottom)
R
θJB
17
°C/W
3
Junction to Case (Top)
R
θJC
9
°C/W
4
NOTES:
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, board population, and board thermal resistance.
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883 Method 1012.1).
This device contains circuitry to protect the
inputs against damage due to high static volt-
ages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maxi-
mum rated voltages to this high–impedance
circuit.


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