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5 / 17 page www.sensirion.com November 2016 - Version 1 5/17 3 Pin Assignment The STS3x-DIS comes in a tiny 8-pin DFN package – see Table 5. Pin Name Comments 1 SDA Serial data; input / output 2 ADDR Address pin; input; connect to either logic high or low, do not leave floating 3 ALERT Indicates alarm condition; output; must be left floating if unused 4 SCL Serial clock; input / output 5 VDD Supply voltage; input 6 nRESET Reset pin active low; input; if not used it is recommended to be left floating 7 R No electrical function; to be connected to VSS 8 Ground Table 5 STS3x-DIS pin assignment (transparent top view). Dashed lines are only visible if viewed from below. The die pad is internally connected to . 3.1 Power Pins (VDD, VSS) The electrical specifications of the STS3x-DIS are shown in Table 2. The power supply pins must be decoupled with a 100 nF capacitor that shall be placed as close to the sensor as possible – see Figure 4 for a typical application circuit. 3.2 Serial Clock and Serial Data (SCL, SDA) SCL is used to synchronize the communication between microcontroller and the sensor. The clock frequency can be freely chosen between 0 to 1000 kHz. Commands with clock stretching according to I2C Standard6 are supported. The SDA pin is used to transfer data to and from the sensor. Communication with frequencies up to 400 kHz must meet the I2C Fast Mode6 standard. Communication 6 http://www.nxp.com/documents/user_manual/UM10204.pdf frequencies up to 1 MHz are supported following the specifications given in Table 18. Both SCL and SDA lines are open-drain I/Os with diodes to VDD and VSS. They should be connected to external pull-up resistors (please refer to Figure 4). A device on the I2C bus must only drive a line to ground. The external pull-up resistors (e.g. Rp=10 kΩ) are required to pull the signal high. For dimensioning resistor sizes please take bus capacity and communication frequency into account (see for example Section 7.1 of NXPs I2C Manual for more details6). It should be noted that pull-up resistors may be included in I/O circuits of microcontrollers. It is recommended to wire the sensor according to the application circuit as shown in Figure 4. Figure 4 Typical application circuit. Please note that the positioning of the pins does not reflect the position on the real sensor. This is shown in Table 5. 3.3 Die Pad (center pad) The die pad or center pad is visible from below and located in the center of the package. It is electrically connected to . Hence electrical considerations do not impose constraints on the wiring of the die pad. However, due to mechanical reasons it is recommended to solder the center pad to the PCB. For more information on design-in, please refer to the document “SHTxx Design Guide”. 3.4 ADDR Pin Through the appropriate wiring of the ADDR pin the I2C address can be selected (see Table 6 for the respective addresses). The ADDR pin can either be connected to logic high or logic low, or it can be used as a selector pin. This means that the address of the sensor can be changed dynamically during operation by switching the level on the ADDR pin. The only constraint is that the level has to stay constant starting from the I2C start condition until the communication is finished. This allows to connect more than two STS3x-DIS onto the same bus. 1 2 3 4 5 8 7 6 V DD RR PP ADDR(2) ALERT(3) die pad R(7) SDA(1) SCL(4) VDD(5) VSS(8) nRESET(6) |
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