STS30 datasheet(5/17 Pages) ETC2

Part #	STS30

Description	Fully calibrated and linearized digital output

Download	17 Pages

Scroll/Zoom	100%

Manufacturer	ETC2 [List of Unclassifed Manufacturers]

Direct Link

Logo

5 / 17 page

www.sensirion.com

November 2016 - Version 1

5/17

3 Pin Assignment

The STS3x-DIS comes in a tiny 8-pin DFN package –

see Table 5.

Name

Comments

1

SDA

Serial data; input / output

2

ADDR

Address pin; input; connect to either

logic high or low, do not leave

floating

3

ALERT

Indicates alarm condition; output;

must be left floating if unused

4

SCL

Serial clock; input / output

5

VDD

Supply voltage; input

6

nRESET

Reset pin active low; input; if not

used it is recommended to be left

floating

7

R

No electrical function; to be

connected to VSS

8

Ground

Table 5 STS3x-DIS pin assignment (transparent top view).

Dashed lines are only visible if viewed from below. The die

pad is internally connected to

.

3.1

Power Pins (VDD, VSS)

The electrical specifications of the STS3x-DIS are shown

in Table 2. The power supply pins must be decoupled

with a 100 nF capacitor that shall be placed as close to

the sensor as possible – see Figure 4 for a typical

application circuit.

3.2

Serial Clock and Serial Data (SCL, SDA)

SCL is used to synchronize the communication between

microcontroller and the sensor. The clock frequency can

be freely chosen between 0 to 1000 kHz. Commands

with clock stretching according to I2C Standard6 are

supported.

The SDA pin is used to transfer data to and from the

sensor. Communication with frequencies up to 400 kHz

must meet the I2C Fast Mode6 standard. Communication

6

http://www.nxp.com/documents/user_manual/UM10204.pdf

frequencies up to 1 MHz are supported following the

specifications given in Table 18.

Both SCL and SDA lines are open-drain I/Os with diodes

to VDD and VSS. They should be connected to external

pull-up resistors (please refer to Figure 4). A device on

the I2C bus must only drive a line to ground. The external

pull-up resistors (e.g. Rp=10 kΩ) are required to pull the

signal high. For dimensioning resistor sizes please take

bus capacity and communication frequency into account

(see for example Section 7.1 of NXPs I2C Manual for

more details6). It should be noted that pull-up resistors

may be included in I/O circuits of microcontrollers. It is

recommended to wire the sensor according to the

application circuit as shown in Figure 4.

Figure 4 Typical application circuit. Please note that the

positioning of the pins does not reflect the position on the

real sensor. This is shown in Table 5.

3.3

Die Pad (center pad)

The die pad or center pad is visible from below and

located in the center of the package. It is electrically

connected to

. Hence electrical considerations do not

impose constraints on the wiring of the die pad.

However, due to mechanical reasons it is recommended

to solder the center pad to the PCB. For more

information on design-in, please refer to the document

“SHTxx Design Guide”.

3.4

ADDR Pin

Through the appropriate wiring of the ADDR pin the I2C

address can be selected (see Table 6 for the respective

addresses). The ADDR pin can either be connected to

logic high or logic low, or it can be used as a selector pin.

This means that the address of the sensor can be

changed dynamically during operation by switching the

level on the ADDR pin. The only constraint is that the

level has to stay constant starting from the I2C start

condition until the communication is finished. This allows

to connect more than two STS3x-DIS onto the same bus.

1

2

3

4

5

8

7

6

V

DD

RR

PP

ADDR(2)

ALERT(3)

die

pad

R(7)

SDA(1)

SCL(4)

VDD(5)

VSS(8)

nRESET(6)

Similar Part No. - STS30

Manufacturer	Part #	Datasheet	Description
STMicroelectronics	STS30N3LLH6	776Kb / 13P	High avalanche ruggedness July 2009 Rev 2

More results

Similar Description - STS30

Manufacturer	Part #	Datasheet	Description
List of Unclassifed Man...	SHT30	910Kb / 20P	Fully calibrated, linearized, and temperature compensated digital output
Freescale Semiconductor...	MPXY8020A	284Kb / 16P	Tire Pressure Monitoring Sensor Temperature Compensated and Calibrated, Fully Integrated Digital Output
	MPXY8021A	299Kb / 15P	Tire Pressure Monitoring Sensor Temperature Compensated and Calibrated, Fully Integrated, Digital Output
	MPXY8020A	303Kb / 17P	Tire Pressure Monitoring Sensor Temperature Compensated and Calibrated, Fully Integrated Digital Output
Motorola, Inc	MPXY8020A	283Kb / 16P	TIRE PRESSURE MONITORING SENSOR TEMPERATURE COMPENSATED AND CALIBRATED FULLY INTEGRATED DIGITAL OUTPUT
List of Unclassifed Man...	LPG10	354Kb / 5P	Calibrated and temperature compensated digital output
Amphenol Corporation	T9602	295Kb / 4P	Fully calibrated and temperature compensated
List of Unclassifed Man...	SHT10	355Kb / 12P	Fully calibrated
General Semiconductor	SOP-14	96Kb / 4P	The Fully Calibrated Humidity and Temperature Solution
Amphenol Corporation	CHIPCAP2	222Kb / 4P	Fully Calibrated & Temperature Compensated

More results

STS30 Datasheet(PDF) 5 Page - List of Unclassifed Manufacturers

STS30 Datasheet(HTML) 5 Page - List of Unclassifed Manufacturers

Similar Part No. - STS30

Similar Description - STS30

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

Datasheet Download

Link URL