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ISL68201-99125DEMO1Z Datasheet(PDF) 11 Page - Intersil Corporation

Part # ISL68201-99125DEMO1Z
Description  25A/35A DrMOS Module with Diode Emulation and PS4
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Manufacturer  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

ISL68201-99125DEMO1Z Datasheet(HTML) 11 Page - Intersil Corporation

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ISL99125B, ISL99135B
11
FN8848.4
January 24, 2017
Submit Document Feedback
other circuits. Best practice is to place the decoupling
capacitors on the same PCB side as the device.
• Connect GND to the system ground plane with a large via array
as close to the GND pins as the design rules allow. This
improves thermal and electrical performance.
• Place VCC and BOOT-PHASE decoupling capacitors at the IC
pins as shown in Figure 20.
• Note that the SW plane connecting the ISL99125B,
ISL99135B, and inductor must carry a full load current and will
create resistive loss if not sized properly. However, it is also a
very noisy node that should not be oversized or routed close to
any sensitive signals. Best practice is to place the inductor as
close to the device as possible and thus, minimizing the
required area for the SW connection. If one must choose a
long route of either the VOUT side of the inductor or the SW
side, choose the quiet VOUT side. Best practice is to locate the
ISL99125B, ISL99135B as close to the final load as possible
and thus avoid noisy or lossy routes to the load.
TABLE 3. AVAILABLE EVALUATION BOARDS
EVALUATION BOARDS
DESCRIPTION
SMBus/
PMBus/I2C
ISL68201-99125DEMO1Z
3.3V at 16A design with ISL99125B and the ISL68201 digital hybrid PWM controller.
Yes
ISL68201-99135DEMO1Z
1.0V at 20A design with ISL99135B and the ISL68201 digital hybrid PWM controller.
Yes
FIGURE 20. PCB LAYOUT FOR MINIMIZING CURRENT LOOPS
24
23
22
21
20
19
18
17
67
8
9
10
11
12
16
15
14
13
1
2
3
4
5
SW
SW
SW
SW
PWM
FCCM
BOOT
GH
PHASE
GND
PAD1
VIN
PAD2


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