MAX1192 datasheet(24/28 Pages) MAXIM

Part #	MAX1192

Description	Ultra-Low-Power, 22Msps, Dual 8-Bit ADC

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Manufacturer	MAXIM [Maxim Integrated Products]

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Ultra-Low-Power, 22Msps, Dual 8-Bit ADC

24

______________________________________________________________________________________

Typical QAM Demodulation Application

Quadrature amplitude modulation (QAM) is frequently

used in digital communications. Typically found in

spread-spectrum-based systems, a QAM signal repre-

sents a carrier frequency modulated in both amplitude

and phase. At the transmitter, modulating the baseband

signal with quadrature outputs, a local oscillator fol-

lowed by subsequent upconversion can generate the

QAM signal. The result is an in-phase (I) and a quadra-

ture (Q) carrier component, where the Q component is

90

° phase shifted with respect to the in-phase compo-

nent. At the receiver, the QAM signal is demodulated

into analog I and Q components. Figure 12 displays the

demodulation process performed in the analog domain

using the MAX1192 dual-matched, 3V, 8-bit ADC and

the MAX2451 quadrature demodulator to recover and

digitize the I and Q baseband signals. Before being dig-

itized by the MAX1192, the mixed-down signal compo-

nents can be filtered by matched analog filters, such as

Nyquist or pulse-shaping filters. The filters remove

unwanted images from the mixing process, thereby

enhancing the overall signal-to-noise (SNR) perfor-

mance and minimizing intersymbol interference.

Grounding, Bypassing,

and Board Layout

The MAX1192 requires high-speed board layout design

techniques. Refer to the MAX1193 Evaluation Kit data

sheet for a board layout reference. Locate all bypass

capacitors as close to the device as possible, prefer-

ably on the same side as the ADC, using surface-

mount devices for minimum inductance. Bypass VDD to

GND with a 0.1µF ceramic capacitor in parallel with a

2.2µF bipolar capacitor. Bypass OVDD to OGND with a

0.1µF ceramic capacitor in parallel with a 2.2µF bipolar

capacitor. Bypass REFP, REFN, and COM each to

GND with a 0.33µF ceramic capacitor.

Multilayer boards with separated ground and power

planes produce the highest level of signal integrity. Use

a split ground plane arranged to match the physical

location of the analog ground (GND) and the digital

output driver ground (OGND) on the ADC’s package.

Connect the MAX1192 exposed backside paddle to

GND. Join the two ground planes at a single point such

that the noisy digital ground currents do not interfere

with the analog ground plane. The ideal location of this

connection can be determined experimentally at a

point along the gap between the two ground planes,

which produces optimum results. Make this connection

with a low-value, surface-mount resistor (1

Ω to 5Ω), a

ferrite bead, or a direct short. Alternatively, all ground

pins could share the same ground plane, if the ground

plane is sufficiently isolated from any noisy, digital sys-

tems ground plane (e.g., downstream output buffer or

DSP ground plane).

Route high-speed digital signal traces away from the

sensitive analog traces of either channel. Make sure to

isolate the analog input lines to each respective con-

verter to minimize channel-to-channel crosstalk. Keep

all signal lines short and free of 90

° turns.

0

°

90

°

÷8

DOWNCONVERTER

MAX2451

INA+

MAX1192

INA-

INB+

INB-

DSP

POST-

PROCESSING

A/B

Figure 12. Typical QAM Receiver Application

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