02139-DSH-001-D

Mindspeed Technologies

®

2

Mindspeed Proprietary and Confidential

Typical Eye Diagram

Pad Configuration

Ordering Information

Part Number

Package

Operating Temperature

M02139-13

Waffle Pack

–40 °C to 95 °C

M02139-23

Sawn Quartered Wafer

–40 °C to 95 °C

M02139-33

Expanded whole wafer on a ring

–40 °C to 95 °C

Revision History

Revision

Level

Date

Description

D

Release

August 2011

Added 10G specifications. Added final specifications.

C

Preliminary

March 2011

Removed 10G support and added lower data rate sensitivity performance.

Revised ordering information details.

B

Preliminary

August 2010

Corrected Figure 3-2 and other text edits.

A

Preliminary

April 2010

Initial release.

10.3 Gbps, -15 dBm, 20 mV/div, 16 ps/div

MON

PINA

PINK

AGC

DOUT

GND

GND

1

2

3

4

56

7

13

14

DOUT

NC

9

8

10

12

11

NC

Die size