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HSDL-9000 Datasheet(PDF) 8 Page - Agilent(Hewlett-Packard) |
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HSDL-9000 Datasheet(HTML) 8 Page - Agilent(Hewlett-Packard) |
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8 / 14 page  8 Figure 6. Reflow graph. Reflow Profile The reflow profile is a straight- line representation of a nominal temperature profile for a con- vective reflow solder process. The temperature profile is divided into four process zones, each with different ∆T/∆time tempera- ture change rates. The ∆T/∆time rates detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and I/O pins are heated to a temperature of 160 °C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4 °C per second to allow for even heating of both the PC board and ALPS I/O pins. Process Symbol ∆T Maximum ∆T/∆time Heat Up P1, R1 25 °C to 160°C4°C/s Solder Paste Dry P2, R2 160 °C to 200°C 0.5 °C/s Solder Reflow P3, R3 200 °C to 255°C (260°C at 10 seconds max.) 4 °C/s P3, R4 255 °C to 200°C–6°C/s Cool Down P4, R5 200 °C to 25°C–6°C/s Process zone P2 should be of sufficient time duration (60 to –120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200 °C (392°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255 °C (491°F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about 20 seconds to assure proper coalescence of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 60 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200 °C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25 °C (77°F) should not exceed –6 °C per second maximum. This limitation is necessary to allow the PC board and transceiver’s castellation I/O pins to change dimensions evenly, putting minimal stresses on the ALPS. 0 t-TIME (SECONDS) 230 200 160 120 80 50 150 100 200 250 300 180 220 255 P1 HEAT UP P2 SOLDER PASTE DRY P3 SOLDER REFLOW P4 COOL DOWN 25 R1 R2 R3 R4 R5 60 sec. MAX. ABOVE 220°C MAX. 260°C |
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Similar Description - HSDL-9000 |
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