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HCPL0708 Datasheet(PDF) 3 Page - Agilent(Hewlett-Packard) |
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HCPL0708 Datasheet(HTML) 3 Page - Agilent(Hewlett-Packard) |
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3 / 10 page  3 Insulation and Safety Related Specifications Parameter Symbol Value Units Conditions Minimum External Air L(I01) 4.9 mm Measured from input terminals to output Gap (Clearance) terminals, shortest distance through air. Minimum External L(I02) 4.8 mm Measured from input terminals to output Tracking (Creepage) terminals, shortest distance path along body. Minimum Internal Plastic 0.08 mm Insulation thickness between emitter and Gap (Internal Clearance) detector; also known as distance through insulation. Tracking Resistance CTI ≥175 Volts DIN IEC 112/VDE 0303 Part 1 (Comparative Tracking Index) Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Solder Reflow Thermal Profile All Agilent data sheets report the creepage and clearance inherent to the optocoupler component itself. These dimensions are needed as a starting point for the equipment designer when determining the circuit insulation requirements. However, once mounted on a printed circuit board, minimum creepage and clearance requirements must be met as specified for individual equipment standards. For creepage, the shortest distance path along the surface of a printed circuit board between the solder fillets of the input and output leads must be considered. There are recommended techniques such as grooves and ribs which may be used on a printed circuit board to achieve desired creepage and clearances. Creepage and clearance distances will also change depending on factors such as pollution degree and insulation level. Regulatory Information The HCPL-0708 has been approved by the following organizations: UL Recognized under UL 1577, component recognition program, File E55361. CSA Approved under CSA Component Acceptance Notice #5, File CA88324. VDE Approved according to VDE 0884/06.92, File 6591-23-4880-1005. TUV Approved according to VDE 0884/06.92, Certificate R9650938. 0 TIME (SECONDS) 200 100 50 150 100 200 250 300 0 30 SEC. 50 SEC. 30 SEC. 160°C 140°C 150°C PEAK TEMP. 245°C PEAK TEMP. 240°C PEAK TEMP. 230°C SOLDERING TIME 200°C PREHEATING TIME 150°C, 90 + 30 SEC. 2.5°C ± 0.5°C/SEC. 3°C + 1°C/–0.5°C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3°C + 1°C/–0.5°C/SEC. REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. |
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