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LM4836MTE Datasheet(PDF) 3 Page - National Semiconductor (TI) |
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LM4836MTE Datasheet(HTML) 3 Page - National Semiconductor (TI) |
3 / 16 page Electrical Characteristics for Single-Ended Mode Operation (Continued) (Notes 7, 10) The following specifications apply for V DD = 5V and TA = 25˚C unless otherwise noted. Symbol Parameter Conditions LM4836 Units (Limits) Typical (Note 14) Limit (Note 15) THD+N Total Harmonic Distortion+Noise V OUT =1VRMS, f=1kHz, RL = 10kΩ, A VD =1 0.065 % PSRR Power Supply Rejection Ratio C B = 1.0 µF, f =120 Hz, V RIPPLE = 200 mVrms 58 dB SNR Signal to Noise Ratio P OUT =75 mW, R L =32Ω, A-Wtd Filter 102 dB X talk Channel Separation f=1kHz, C B = 1.0 µF 65 dB Electrical Characteristics for Bridged Mode Operation (Notes 7, 10) The following specifications apply for V DD = 5V and TA = 25˚C unless otherwise noted. Symbol Parameter Conditions LM4836 Units (Limits) Typical (Note 14) Limit (Note 15) V OS Output Offset Voltage V IN = 0V 10 50 mV (max) P O Output Power THD+N=1.0%; f=1kHz; R L =3Ω (Note 8) 2.2 W THD+N=1.0%; f=1kHz; R L =4Ω (Note 9)(Note 15) 2W THD = 1.5% (max);f = 1 kHz; R L =8Ω 1.1 1.0 W (min) THD+N = 10%;f = 1 kHz; R L =8Ω 1.5 W THD+N Total Harmonic Distortion+Noise P O = 1W, 20 Hz< f < 20 kHz, R L =8Ω,AVD =2 0.3 % P O = 340 mW, RL =32Ω 1.0 % PSRR Power Supply Rejection Ratio C B = 1.0 µF, f = 120 Hz, V RIPPLE = 200 mVrms; RL =8Ω 74 dB SNR Signal to Noise Ratio V DD = 5V, POUT = 1.1W, RL =8Ω, A-Wtd Filter 93 dB X talk Channel Separation f=1kHz, C B = 1.0 µF 70 dB Note 3: The θJA given is for an MXA28A package whose exposed-DAP is soldered to an exposed 2in 2 piece of 1 ounce printed circuit board copper. Note 4: The θJA given is for an MXA28A package whose exposed-DAP is soldered to a 2in2 piece of 1 ounce printed circuit board copper on a bottom side layer through 21 8mil vias. Note 5: The θJA given is for an MXA28A package whose exposed-DAP is soldered to an exposed 1in 2 piece of 1 ounce printed circuit board copper. Note 6: The θJA given is for an MXA28A package whose exposed-DAP is not soldered to any copper. Note 7: All voltages are measured with respect to the ground pins, unless otherwise specified. All specifications are tested using the typical application as shown in Figure 2. Note 8: When driving 3 Ω loads from a 5V supply the LM4836MTE exposed DAP must be soldered to the circuit board and forced-air cooled. Note 9: When driving 4 Ω loads from a 5V supply the LM4836MTE exposed DAP must be soldered to the circuit board. Note 10: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance. Note 11: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θ JA, and the ambient temperature TA. The maximum allowable power dissipation is PDMAX =(TJMAX −TA )/θJA. For the LM4836MT, TJMAX = 150˚C, and the typical junction-to-ambient thermal resistance, when board mounted, is 80˚C/W assuming the MTC28 package. Note 12: Human body model, 100 pF discharged through a 1.5 k Ω resistor. Note 13: Machine Model, 220 pF–240 pF discharged through all pins. Note 14: Typicals are measured at 25˚C and represent the parametric norm. Note 15: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level). www.national.com 3 |
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