E

D

e

b

0.25 C A B

0.10

SEE NOTE 3

0,20

A

B

A

A

A1

DETAIL A

SCALE 6 : 1

0.20 C

SEE NOTE 5

0.20 C

C

Ironwood Package code: BGA484C

DESCRIPTION: Compatible BGA

1. Dimensions are in millimeters.

2. Interpret dimensions and tolerances per ASME Y14.5M-1994.

3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.

4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.

5. Parallelism measurement shall exclude any effect of mark on top surface of package.

DIM

Minimum Maximum

A

2.5

A1

0.4

0.6

b

0.70

D

23.00 BSC

E

23.00 BSC

e

1.0 BSC

ARRAY

22 X 22

PIN COUNT

484

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance

±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Compatible BGA

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. B

DATE: 2/7/13

Material: N/A

Finish: N/A

Weight: 48.38

SBT-BGA-6004 Drawing

SCALE: 2:1

SHEET: 3 OF 4

ENG: V. Panavala

FILE: SBT-BGA-6004

DRAWN BY: V. Panavala