1.250±0.125 (x4)

1.250±0.125 (x4)

0.850±0.025 (x2)

non plated alignment hole

2.540±0.025

5.080±0.025

1.710±0.10 (x4)

non plate mounting hole

6.400

0.400 typ

15.225

Socket Base Outline

17.725

Insulation plate outline

3.200±0.025

3.075±0.025

0.250 PAD

Note: Full BGA pattern shown.

Please adjust pattern according

to individual requirements.

Target PCB Recommendations

Total thickness: 1.0mm min.

Plating: Gold or Solder finish

PCB Pad height: Same or higher than solder mask

Note: BGA pattern is not symmetrical with

respect to the mounting holes.

BGA array is shifted 0.125mm from center.

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Recommended PCB Layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 9/11/15

Material: N/A

Finish: N/A

Weight: 9.79

SG25-BGA-2013 Drawing

SCALE: 6:1

SHEET: 2 OF 4

ENG: V. Panavala

FILE: SG25-BGA-2013

DRAWN BY: V. Panavala