E

D

e

e

b

A1

A

B

A

A1

A

DETAIL A

SCALE 16 : 1

C

A1 corner

0.10 C

0.10 C

1. Dimensions are in millimeters.

2. Interpret dimensions and tolerances per ASME Y14.5M-1994.

3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane C.

4. Datum C (seating plane) is defined by the spherical crowns of the solder balls.

5. Parallelism measurement shall exclude any effect of mark on top surface of package.

Note: Full BGA pattern shown.

Please adjust pattern according

to individual requirements.

Ironwood package code: BGA1156B

DIM

Minimum

Maximum

A

1.59

A1

0.15

0.23

b

0.20

0.30

D

14.0 BSC

E

14.0 BSC

e

0.4

ARRAY

34x34

PIN COUNT

1156

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance

±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change

without notice.

Description: Compatible BGA

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. B

DATE: 1/10/2015

Material: Material <not specified>

Finish:

Weight: 17.17

SG25-BGA-2000 Drawing

SCALE: 5:1

SHEET: 3 OF 4

ENG: V. Panavala

FILE: SG25-BGA-2000

DRAWN BY: V. Panavala