2

CHArACtEristiCs

XHP70 LEDs are tested and binned in the 12-V configuration. See the Mechanical Dimensions section on page 23 for pad layout

options.

Characteristics

unit

Minimum

typical

Maximum

Thermal resistance, junction to solder point

°C/W

0.9

viewing angle (FWHM)

degrees

120

Temperature coefficient of voltage (6 V)*

mV/°C

-4.25

Temperature coefficient of voltage (12 V)

mV/°C

-8.5

ESD withstand voltage (HBM per Mil-Std-883D)

v

8000

DC forward current (6 V)*

mA

4800

DC forward current (12 V)

mA

2400

Reverse voltage

v

-5

Forward voltage (6 V, @ 2100 mA, 85 °C)*

v

5.8

6.2

Forward voltage (12 V, @ 1050 mA, 85 °C)

v

11.6

12.4

LeD junction temperature

°C

150

Note:

*

Data for the 6-V configuration is calculated and for reference only.