XHP50B-00-0000-0D0HH40E5 datasheet(1/25 Pages) CREE

Part #	XHP50B-00-0000-0D0HH40E5

Description	XLamp XHP50.2 LEDs

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Manufacturer	CREE [Cree, Inc]

Direct Link	http://www.cree.com/

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Product family data sheet

are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

Cree® XLamp® XHP50.2 LEDs

ProDuCt DEsCriPtion

The XLamp XHP50.2 LeD is the next

generation of extreme High Power LeDs

that delivers the lowest system cost

through the best lumen density, reliability

and color consistency. Built on Cree’s

latest high-power LeD technology, the

XHP50.2 LeD improves the lumen density,

voltage characteristics, reliability and

optical performance of the XHP50 LeD in

the same 5.0 mm x 5.0 mm footprint. The

new XHP50.2 LeD provides an easy drop-in

upgrade to achieve higher system LPW

for lighting manufacturers with existing

XHP50 designs, eliminating redesign costs.

Its unparalleled lumen density and longer

lifetime at higher operating temperatures

also enables new and innovative lighting

designs at lower system costs.

FEAturEs

• Available in white, configurable to 6 V

or 12 V by PCB layout

• Available in 5-step easyWhite® bins

at 3000 K to 5000 K CCT, 3-step

EasyWhite bins at 2700 K to 5000 K

and 2-step EasyWhite bins at 2700 K

to 4000 K CCT

• Available in ANSI white bins at

3000 K to 7000 K CCT

• Available in standard, 70-, 80-, and

90-minimum CRI options

• Binned at 85 °C

• Maximum drive current: 3000 mA

(6 V), 1500 mA (12 V)

• Low thermal resistance: 1.2 °C/W

• Wide viewing angle: 120°

• Unlimited floor life at

≤ 30 ºC/85% RH

• Reflow solderable - JEDEC

J-STD-020C

• UL® recognized component

(E349212)

tAbLE oF ContEnts

Characteristics ..............................................2

Flux Characteristics, easyWhite® Order

Codes and Bins .............................................3

Flux Characteristics, ANSI White Order

Codes and Bins .............................................5

Relative Spectral Power Distribution ...........7

Relative Flux vs. Junction Temperature.......7

electrical Characteristics..............................8

Relative Flux vs. Current ...............................9

Relative Chromaticity vs Current............... 10

Relative Chromaticity vs Temperature...... 11

Typical Spatial Distribution........................ 11

Thermal Design.......................................... 12

Performance Groups – Luminous Flux..... 13

Performance Groups – Chromaticity........ 13

Cree’s easyWhite® Chromaticity Regions

Plotted on the 1931 CIe Curve .................. 16

Cree’s ANSI Cool White Kits Plotted on

ANSI Standard Chromaticity Regions....... 17

Cree’s ANSI Warm and Neutral White Kits

Plotted on ANSI Standard Chromaticity

Regions....................................................... 18

Bin and Order Code Formats..................... 19

Reflow Soldering Characteristics.............. 20

Notes .......................................................... 21

Mechanical Dimensions ............................ 22

Electrical Configuration ............................. 23

Tape and Reel............................................. 24

Packaging................................................... 25

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