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XB-H Datasheet(PDF) 2 Page - Cree, Inc |
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XB-H Datasheet(HTML) 2 Page - Cree, Inc |
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2 / 13 page  Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 2 XLamp® XB-H LED CHArACtEristiCs Characteristics unit Minimum typical Maximum Thermal resistance, junction to solder point °C/W 4 Viewing angle (FWHM) degrees 110 Temperature coefficient of voltage mV/°C ‑2.2 ESD withstand voltage (HBM per Mil‑Std‑883D) v 8000 DC forward current mA 1500 Reverse voltage v 5 Forward voltage (@ 700 mA, 85 °C) v 2.9 3.3 Forward voltage (@ 1000 mA, 85 °C) v 3.0 Forward voltage (@ 1500 mA, 85 °C) v 3.15 LeD junction temperature °C 150 |
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