ISL68134

4

FN8817.0

September 28, 2016

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PIN NUMBER

PIN NAME

DESCRIPTION

4, 3, 2, 1

PWM[3:0] Pulse width modulation outputs. Connect these pins to the PWM input pins of 3.3V logic compatible Intersil smart power

stages, driver IC(s) or power stages.

5

AVS_CLK AVSBus clock input pin. Connect to ground if not used.

6

AVS_SDA AVSBus data output pin. Leave open if not used.

7

AVS_MDA AVSBus data input pin. Connect to ground if not used.

8

AVS_VDDIO AVSBus reference voltage input pin. Leave open if not used.

9, 10, 38, 39,

40

DNC

Do not connect any signals to these pins.

11

EN0

Input pin used for enable control of Output 0. Active high. Connect to ground if not used.

12

EN1

Input pin used for enable control of Output 1. Active high. Connect to ground if not used.

13

TWARN

Thermal warning flag. This open-drain output will be pulled low in the event of a sensed over-temperature at TMON pins

14

PG0

15

PG1

16

SCL

17

SDA

18

SALRT

19

CONFIG

Configuration ID selection pin. See Table 3 on page 16 for more details.

20

VINSEN

Input voltage sense pin. Connect to VIN through a resistor divider (typically 40.2k/10k) with a 10nF decoupling capacitor.

21

VSEN1

Positive differential voltage sense input for Output 1. Connect to positive remote sensing point. Connect to ground if not

used.

22

RGND1

Negative differential voltage sense input for Output 1. Connect to negative remote sensing point. Connect to ground if not

used.

23, 25, 27, 29 CSRTN[3:0] The CS and CSRTN pins are current sense inputs to individual phase differential amplifiers. Unused phases should have

their respective current sense inputs grounded. The ISL68134 supports smart power stage, DCR and resistor sensing.

Connection details depend on current sense method chosen.

24, 26, 28, 30

CS[3:0]

31

RGND0

Negative differential voltage sense input for Output 0. Connect to negative remote sensing point. Connect to ground if not

used.

32

VSEN0

Positive differential voltage sense input for Output 0. Connect to positive remote sensing point. Connect to ground if not

used.

33

TMON0

Input pin for external temperature measurement at Output 0. Supports diode based temperature sensing as well as smart

power stage sensing. Refer to “Temperature Compensation” on page 14 for more information.

34

TMON1

Input pin for external temperature measurement at Output 1. Supports diode based temperature sensing as well as smart

power stage sensing. Refer to “Temperature Compensation” on page 14 for more information.

35

VCC

Chip primary bias input. Connect this pin directly to a +3.3V supply with a high quality MLCC bypass capacitor.

36

VCCS

Internally generated 1.2V LDO logic supply from VCC. Decouple with 4.7µF or greater MLCC (X5R or better).

37

SA

PMBus™ Address selection pin. See Table 2 on page 12 for more details.

EPAD

GND

Package pad serves as GND return for all chip functions. Connect directly to system GND plane with multiple thermal vias.