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P2300SB Datasheet(PDF) 3 Page - JIEJIE MICROELECTRONICS CO.,Ltd |
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P2300SB Datasheet(HTML) 3 Page - JIEJIE MICROELECTRONICS CO.,Ltd |
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3 / 5 page  PxxxxSB Series JieJie Microelectronics CO. , Ltd TEL：+86-513-83639777 - 3 / 5- http://www.jjwdz.com ORDERING INFORMATION MARKING P-8B : Device Marking Code 1409: In ninth week, 2014 1409 P-8B SOLDERING PARAMETERS Reflow Condition Pb-Free assembly (see FIG.2) Pre Heat -Temperature Min (Ts(min)) +150℃ -Temperature Max(Ts(max)) +200℃ -Time (Min to Max) (ts) 60-180 secs. Average ramp up rate (Liquid us Temp (TL) to peak) 3℃/sec. Max Ts(max) to TL - Ramp-up Rate 3℃/sec. Max Reflow -Temperature(TL) (Liquid us) +217℃ -Temperature(tL) 60-150 secs. Peak Temp (Tp) +260(+0/-5)℃ Time within 5℃ of actual Peak Temp (tp) 30 secs. Max Ramp-down Rate 6℃/sec. Max Time 25℃ to Peak Temp (TP) 8 min. Max Do not exceed +260℃ |
Similar Part No. - P2300SB |
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Similar Description - P2300SB |
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