© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

C1091_C0G_ESD • 12/5/2016

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)

Soldering Process

Recommended Soldering Technique:

•SolderwaveorsolderreflowforEIAcasesizes0603,0805and1206

•AllotherEIAcasesizesarelimitedtosolderreflowonly

Recommended Reflow Soldering Profile:

KEMET’sfamiliesofsurfacemountmultilayerceramiccapacitors(SMDMLCCs)arecompatiblewithwave(singleordual),

convection,IRorvaporphasereflowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermal

stress.KEMET’srecommendedprofileconditionsforconvectionandIRreflowreflecttheprofileconditionsoftheIPC/J-

STD-020standardformoisturesensitivitytesting.Thesedevicescansafelywithstandamaximumofthreereflowpassesat

theseconditions.

Profile Feature

Termination Finish

100% Matte Sn

Preheat/Soak

Temperature Minimum (T

150°C

Temperature Maximum (T

200°C

Time (t

60–120seconds

Ramp-UpRate(T

3°C/secondmaximum

LiquidousTemperature(T

217°C

TimeAboveLiquidous(t

60–150seconds

Peak Temperature (T

260°C

TimeWithin5°CofMaximumPeak

Temperature (t

30secondsmaximum

Ramp-DownRate(T

6°C/secondmaximum

Time25°CtoPeakTemperature

8 minutes maximum

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reflow.

Time

T

smin

25

T

smax

T

L

T

P

Maximum Ramp Up Rate = 3ºC/sec

Maximum Ramp Down Rate = 6ºC/sec

t

P

t

L

t

s

25ºC to Peak