© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

C1091_C0G_ESD • 12/5/2016

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)

Table 5 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

TerminalStrength

JIS–C–6429

Appendix1,Note:Forceof1.8kgfor60seconds.

BoardFlex

JIS–C–6429

Appendix2,Note:Standardterminationsystem–2.0mm(minimum)forallexcept3mmfor

C0G. Flexible termination system – 3.0 mm (minimum).

Solderability

J–STD–002

Magnification50X.Conditions:

a)MethodB,4hoursat155°C,dryheatat235°C

b)MethodBat215°Ccategory3

c)MethodD,category3at260°C

Temperature Cycling

JESD22MethodJA–104

1,000Cycles(−55°Cto+125°C).Measurementat24hours+/−4hoursaftertestconclusion.

BiasedHumidity

MIL–STD–202Method

103

LoadHumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.

Measurementat24hours+/−4hoursaftertestconclusion.

LowVoltHumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.

Measurementat24hours+/−4hoursaftertestconclusion.

MoistureResistance

MIL–STD–202Method

106

t=24hours/cycle.Steps7aand7bnotrequired.

Measurementat24hours+/−4hoursaftertestconclusion.

ThermalShock

MIL–STD–202Method

107

−55°C/+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20

seconds.

Dwell time – 15 minutes. Air – Air.

HighTemperatureLife

MIL–STD–202Method

108/EIA–198

1,000hoursat125°C(85°CforX5R,Z5UandY5V)with2Xratedvoltageapplied.

Storage Life

MIL–STD–202Method

108

150°C,0VDCfor1,000hours.

Vibration

MIL–STD–202Method

204

5g'sfor20minutes,12cycleseachof3orientations.Note:Use8"X5"PCB0.031"thick

7securepointsononelongsideand2securepointsatcornersofoppositesides.Parts

mountedwithin2"fromanysecurepoint.Testfrom10–2,000Hz

MechanicalShock

MIL–STD–202Method

213

Figure1ofMethod213,ConditionF.

ResistancetoSolvents

MIL–STD–202Method

215

Addaqueouswashchemical,OKEMCleanorequivalent.

Storage and Handling

Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustin

otherenvironments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,

andlongtermstorage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarp

andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximum

storagehumiditynotexceed70%relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationon

thepartsandatmospheresshouldbefreeofchlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstock

shouldbeusedpromptly,preferablywithin1.5yearsofreceipt.