253

Z Series

Corcom Product Guide

Z Series

Low Profile Unfiltered Modular Jacks

6

Dimensions are in inches and millimeters unless otherwise specified. Values in italics

are metric equivalents. Dimensions are shown for reference purposes only.

Specifications subject to change.

Catalog: 1654001

Issue Date: 06.2011

For email, phone or live chat, please go to

te.com/help

corcom.com

UL Recognized

CSA Certified

• Low profile

• Unfiltered

• Available unshielded or shielded with board

grounded shield or spring fingered panel

ground interface

RJ11-6Z

RJ45-8Z

RJ11-6Z3

RJ45-8Z3

RJ11-6Z4

RJ45-8Z4

Available Part Numbers

Shield 3

RJ11

Specifications

Shield 4

RJ45

Model dimensions and PC board layout on pages 255-259

Contacts:

Material:

Phosphor Bronze

Plating:

50 microinches gold

Barrier underplating:

100 microinches nickel

Resistance:

Initial:

20 m

 max.

After 500 mating cycles:

30 m

 max.

Shield Material:

Tin-plated copper alloy

Housing Material:

Black glass-filled polyester

(VALOX 457)

Dielectric Withstanding Voltage:

Line to Line and Line to Ground:

1000 VAC for

60 seconds

Printed Circuit Board Retention:

Before soldering:

1 lb. minimum

After soldering:

20 lb. minimum