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LM3543 Datasheet(PDF) 3 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part No. LM3543
Description  Triple Port USB Power Distribution Switch and Over-Current Protection
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Maker  NSC [National Semiconductor (TI)]
Homepage  http://www.national.com
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LM3543 Datasheet(HTML) 3 Page - National Semiconductor (TI)

 
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Voltage at IN
X and OUTX pins
−0.3V to 6V
Voltage at EN
X(ENX) and FLAGX
pins
−0.3V to 5.5V
Power Dissipation
(Note 2)
Internally Limited
Maximum Junction Temperature
150˚C
Storage Temperature Range
−65˚C to 150˚C
Lead Temperature Range
(Soldering, 5 sec.)
260˚C
ESD Rating (Note 3)
2 kV
Operating Ratings
Supply Voltage Range
2.7V to 5.5V
Continuous Output Current Range
(Each Output)
0 mA to 500 mA
Junction Temperature Range
−40˚C to 125˚C
DC Electrical Characteristics
Limits in standard typeface are for T
J = 25˚C, and limits in boldface type apply over the full operating temperature range. Un-
less otherwise specified: V
IN = 5.0V, ENX =VIN (LM3543-H) or ENX = 0V (LM3543-L).
Symbol
Parameter
Conditions
Min
Typ
Max
Units
R
ON
On Resistance
V
IN = 5V, IOUTX = 0.5A
90
125
m
V
IN = 3.3V, IOUTX = 0.5A
95
130
I
OUT
OUT
X Continuous Output
Current
3.0V
≤ V
IN ≤ 5.5V
0.5
A
I
LEAK-OUT
OUT
X Leakage Current
EN
X = 0 (ENX =VIN);
T
J = 25˚C
0.01
1
µA
EN
X = 0 (ENX =VIN);
−40
≤ T
J ≤ 85˚C
10
µA
I
SC
OUT
X Short-Circuit Current
(Note 4)
OUT
X Connected to GND
0.8
1.25
A
OC
THRESH
Overcurrent Threshold
2.0
3.2
A
V
L_FLAG
FLAG
X Output-Low Voltage
I(FLAG
X)=10 mA
0.1
0.3
V
I
LEAK-FLAG
FLAG
X Leakage Current
2.7
≤ V
FLAG ≤ 5.5V
0.2
1
µA
I
LEAK-EN
EN
x Input Leakage Current
EN
x/ENx =0Vor
EN
x/ENx =VIN
−0.5
0.5
µA
V
IH
EN/EN Input Logic High
2.7V
≤ V
IN ≤ 5.5V
2.4
V
V
IL
EN/EN Input Logic Low
4.5V
≤ V
IN ≤ 5.5V
0.8
V
2.7V
≤ V
IN ≤ 4.5V
0.4
V
UVLO
Under-Voltage Lockout
Threshold
1.8
V
I
DDON
Operational Supply Current
EN
x =VIN (ENx =0);
T
J = 25˚C
375
600
µA
EN
x =VIN (ENx =0);
−40˚C
≤ T
J ≤ 125˚C
800
µA
I
DDOFF
Shutdown Supply Current
EN
x = 0 (ENx =VIN);
T
J = 25˚C
1µA
−40˚C
≤ T
J ≤ 125˚C
5
µA
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
beyond its rated operating conditions.
Note 2: The maximum allowable power dissipation is a function of the Maximum Junction Temperature (TJMAX), Junction to Ambient Thermal Resistance (θJA), and
the Ambient Temperature (TA). The LM3543 in the 16-pin SOIC package has a TJMAX of 150˚C and a θJA of 130˚C/W. The maximum allowable power dissipation
at any temperature is PMAX =(TJMAX −TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the part will go into
thermal shutdown.
Note 3: The Human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin.
Note 4: Thermal Shutdown will protect the device from permanent damage.
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