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DF-C-PO(B) Datasheet(PDF) 5 Page - Hirose Electric

Part No. DF-C-PO(B)
Description  1.7mm pitch, Low Profile Wire-to-Board Connectors for Power Supplies
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Maker  HIROSE [Hirose Electric]
Homepage  http://www.hirose-connectors.com
Logo HIROSE - Hirose Electric

DF-C-PO(B) Datasheet(HTML) 5 Page - Hirose Electric

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5
DF65 Series1.7mm pitch, Low Profile Wire-to-Board Connectors for Power Supplies
Tooling Information
Item
Part No.
HRS No.
Applicable contact
Applicator
AP105-DF65-2428S
901-4630-0 00
DF65-2428SCF, DF65-2428SCFA
Press body
CM-105C
901-0001-0 00
Hand tool
HT305/DF65-2428S (Note3)
550-0306-8 00
DF65-2428SCF, DF65-2428SCFA
Extraction tool
DF-C-PO
(B)
550-0179-2 00
DF65-2428SCF
Note 1 : Hirose does not cover damage created by the use of unapproved Hirose Tools. Please contact your local
Hirose Sales for clarification.
Note 2 : Please conduct crimping work according to the "Crimping work standards" and "Crimping condition table".
Note 3 : The compatible wire is limited to UL10368, 24 to 28 AWG.
Precautionary notes
1. Recommended Soldering
Profile
(Compatible with lead-free
soldering)
[Applicable Conditions]
1. Peak temperature : MAX 250ç
2. Heating Area: 220ç or above, within 60sec .
3. Preheating Area: 150~180ç , 90~120 sec.
* Measurement is conducted at the contact lead part
Please check the mounting conditions before use, conditions such as
solder paste types, manufacturer, PCB size and any other soldering
materials may alter the performance of such materials.
(Note 1) This temperature profile is a recommended value only; please
contact your Hirose Sales Rep for more information
2. Recommended hand
soldering conditions
Temperature of soldering iron: 350±10ç, soldering time: no more than 3
seconds
3. Recommended screen
thickness, aperture ratio
(pattern surface ratio)
Thickness: 0.1mm, aperture opening ratio: 100%
4. Warping of PC Board
A maximum of 0.02mm at the center of connector, as measured from either
end of the connector
5. Cleaning Conditions
IPA cleaning is allowed. (Cleaning is not recommended because
cleaning may change the push/pull feeling etc. Please contact your local
Hirose representative prior to the use of any cleaning agents.)
6. Precautions
■ When inserting the crimp contact into the crimp socket, do not insert it at a
slanted angle to maintain the reliability of its performance.
■ Please use caution when mating/unmating this connector if it has not been
mounted onto the PCB, doing so could deform or damage the contacts.
■ Do not pull on the wires of this connector as this may cause damage to the
connector.
■ During the hand soldering process, make sure to not apply too much flux.
Doing so may cause a solder wicking problem.
■ This product may experience some differences in color from one production
lot to another. This color difference does not influence the performance of
the connector.
■ For handling precautions to be used during the insertion/removal process,
please refer to the “DF65 Push-pull procedure”.


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