B272

DF20 Series

BUsage recommendation

1. Recommended Soldering

Temperature Profile for IR Reflow.

2. Recommended Manual Soldering Conditions

3. Recommended Solder Screen Thickness

4. Board Warping

5. Cleaning Conditions

6. Wiring Termination Conditions

7. Mating / un-mating precautions

Soldering temperature: 290°C ±10°C, Soldering time: within 3 sec.

0.15mm

Maximum of 0.03 mm at the connector center section, with both ends of the connector as reference points.

Refer to "Nylon Connector Use Handbook."

Refer to "Nylon Connector Use Handbook."

Crimp contacts should be handled with care as not to cause any deformation or damage

affecting the performance or termination.

Excessive twisting and pulling on wires during mating/un-mating should be avoided as it

may cause damage to connectors.

Note 1: Up to 2 cycles of reflow soldering are possible under the same conditions, provided

that there is a return to normal temperature between the first and second cycle.

Note 2: The temperature indicates the board surface temperature at the points of contacts

with the connector terminals.

DF20F–*DP–1H(59)

Temperature

250

200

150

100

60 to 120(s)

60(s) max

220

240

60

120

180

240

300

10(s) max

Time(S)

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.