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72V261LA15TFG8 Datasheet(PDF) 23 Page - Integrated Device Technology |
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72V261LA15TFG8 Datasheet(HTML) 23 Page - Integrated Device Technology |
23 / 27 page IDT72V261LA/72V271LA 3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9 23 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES WCLK t ENH t CLKH tCLKL WEN PAF RCLK (3) REN 4673 drw 19 t ENS t ENH t ENS D - (m+1) words in FIFO(2) D - m words in FIFO(2) tSKEW2 1 2 12 D-(m+1) words in FIFO(2) tPAF tPAF Figure 18. Half-Full Flag Timing (IDT Standard and FWFT Modes) WCLK t ENH t CLKH tCLKL WEN PAE RCLK t ENS tPAE tSKEW2 tPAE 12 12 (4) REN 4673 drw 20 t ENS t ENH n+1 words in FIFO (2), n+2 words in FIFO (3) n words in FIFO (2), n+1 words in FIFO (3) n words in FIFO (2), n+1 words in FIFO (3) WCLK tENS tENH WEN HF tENS RCLK REN 4673 drw 21 D/2 words in FIFO(1), [ + 1 ] words in FIFO(2) D-1 2 D/2 + 1 words in FIFO (1), [ + 2 ] words in FIFO(2) D-1 2 D/2 words in FIFO(1), [ + 1 ] words in FIFO(2) D-1 2 tCLKH tCLKL tHF tHF Figure 17. Programmable Almost-Empty Flag Timing (IDT Standard and FWFT Modes) Figure 16. Programmable Almost-Full Flag Timing (IDT Standard and FWFT Modes) NOTES: 1. For IDT Standard mode: D = maximum FIFO depth. D = 16,384 for the IDT72V261LA and 32,768 for the IDT72V271LA. 2. For FWFT mode: D = maximum FIFO depth. D = 16,385 for the IDT72V261LA and 32,769 for the IDT72V271LA. NOTES: 1. n = PAE offset. 2. For IDT Standard mode. 3. For FWFT mode. 4. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that PAE will go HIGH (after one RCLK cycle plus tPAE). If the time between the rising edge of WCLK and the rising edge of RCLK is less than tSKEW2, then the PAE deassertion may be delayed one extra RCLK cycle. 5. PAE is asserted and updated on the rising edge of WCLK only. NOTES: 1. m = PAF offset. 2. D = maximum FIFO depth. In IDT Standard mode: D = 16,384 for the IDT72V261LA and 32,768 for the IDT72V271LA. In FWFT mode: D = 16,385 for the IDT72V261LA and 32,769 for the IDT72V271LA. 3. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH (after one WCLK cycle plus tPAF). If the time between the rising edge of RCLK and the rising edge of WCLK is less than tSKEW2, then the PAF deassertion time may be delayed one extra WCLK cycle. 4. PAF is asserted and updated on the rising edge of WCLK only. |
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