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TDP158 Datasheet(PDF) 6 Page - Texas Instruments

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Part No. TDP158
Description  6-Gbps, AC-Coupled to TMDS or HDMI Redriver
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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TDP158 Datasheet(HTML) 6 Page - Texas Instruments

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6
TDP158
SLLSEX2 – DECEMBER 2016
www.ti.com
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Copyright © 2016, Texas Instruments Incorporated
Recommended Operating Conditions (continued)
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VIH
High-level input voltage at OE, A1/EQ2, A0/EQ1, TERM, I2C_EN, SLEW
pins only
2.2
V
High-level input voltage at SDA_SRC, SCL_SRC, SDA_CTL/PRE,
SCL_CTL/SWAP
0.7 x VCC
V
High-level input voltage at SDA_SNK, SCL_SNK
2.9
V
High-level input voltage at HPD
2
V
VOL
Low-level output voltage
0.4
V
VOH
High-level output voltage
2.4
V
fSCL
SCL clock frequency fast I2C mode for local I2C control
400
kHz
C(bus,DDC)
Total capacitive load for each bus line supporting 400 kHz (DDC
terminals)
400
pF
C(bus,I2C)
Total capacitive load for each bus line (local I2C terminals)
100
pF
dR(DDC)
DDC Data rate
400
kbps
IIH
High level input current
–30
30
µA
IIM
Mid level input current
–20
20
µA
IIL
Low level input current
–10
10
µA
IOZ
High impedance outpupt current
10
µA
R(OEPU)
Pull up resistance on OE pin
150
250
K
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
TDP158
UNIT
RSB (WQFN)
40 PINS
RθJA
Junction-to-ambient thermal resistance
3.7
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
23.1
°C/W
RθJB
Junction-to-board thermal resistance
9.9
°C/W
ψJT
Junction-to-top characterization parameter
0.3
°C/W
ψJB
Junction-to-board characterization parameter
3.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
3.2
°C/W


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