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LM3490 Datasheet(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part No. LM3490
Description  100 mA, SOT-23, Quasi Low-Dropout Linear Voltage Regulator with Logic-Controlled ON/OFF
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Maker  NSC [National Semiconductor (TI)]
Homepage  http://www.national.com
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LM3490 Datasheet(HTML) 4 Page - National Semiconductor (TI)

 
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LM3490-12, LM3490-15
V
IN = VNOM + 1.5V unless otherwise noted. Typicals and limits appearing in normal type apply for TA = TJ = 25˚C. Limits ap-
pearing in boldface type apply over the entire junction temperature range for operation, −40 to +125˚C. (Notes 9, 10, 11)
Nominal Output Voltage (V
NOM)
12V
15V
Units
Symbol
Parameter
Conditions
Typical
Limit
Typical
Limit
V
OUT
Output Voltage
1 mA
≤ I
OUT ≤ 100 mA
12.00
11.52
11.40
12.48
12.60
15.00
14.40
14.25
15.60
15.75
V
V(min)
V(min)
V(max)
V(max)
∆V
OUT
Line Regulation
V
NOM + 1.5V ≤ VIN ≤ 30V,
I
OUT = 1mA
14
40
16
40
mV
mV(max)
∆V
OUT
Load Regulation
10 mA
≤ I
OUT ≤ 100 mA
36
60
45
75
mV
mV(max)
I
GND
Ground Pin
Current
V
NOM + 1.5V ≤ VIN ≤ 30V,
No Load
V
ON/OFF = 5V
22
mA
44
mA(max)
V
ON/OFF = 0V
0.1
0.1
µA
55
µA(max)
V
IN -
V
OUT
Dropout Voltage
I
OUT = 10 mA
0.7
0.9
1.0
0.7
0.9
1.0
V
V(max)
V(max)
I
OUT = 100 mA
0.9
1.1
1.2
0.9
1.1
1.2
V
V(max)
V(max)
e
n
Output Noise
Voltage
V
IN = 10V,
Bandwidth: 10 Hz to 100 kHz
360
450
µV
rms
V
IL
Maximum Low
Level Input
Voltage at
ON/OFF
0.2
0.2
V(max)
V
IH
Minimum High
Level Input
Voltage at
ON/OFF
2.0
2.0
V(min)
I
IL
V
ON/OFF = 0V
−1
−1
µA(max)
I
IH
V
ON/OFF = 5V
11
µA
20
20
µA(max)
Note 1: The package code MA05B is internal to National Semiconductor Corporation and indicates a specific version of the SOT-23 package and associated me-
chanical drawings.
Note 2: The suffix “I” indicates the junction temperature range for operation is the industrial temperature range, −40 to +125˚C. The suffix “M5” indicates the die is
packaged in the 5-lead SOT-23 package. The suffix “X” indicates the devices will be supplied in blocks of 3k units as opposed to blocks of 250 units.
Note 3: Because the entire part number does not fit on the SOT-23 package, the SOT-23 package is marked with this code instead of the part number.
Note 4: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device
is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical
Characteristics tables.
Note 5: The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using P = (TJ -TA)/θJA where TJ is the junction tem-
perature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. The 400 mW rating results from substituting the Absolute Maximum
junction temperature, 150˚C, for TJ , 50˚C for TA, and 250˚C/W for θJA. More power can be safely dissipated at lower ambient temperatures. Less power can be safely
dissipated at higher ambient temperatures. The Absolute Maximum power dissipation can be increased by 4 mW for each ˚C below 50˚C ambient. It must be derated
by 4 mW for each ˚C above 50˚C ambient. A
θJA of 250˚C/W represents the worst-case condition of no heat sinking of the 5-lead plastic SOT-23 package. Heat sink-
ing enables the safe dissipation of more power. The LM3490 actively limits its junction temperature to about 150˚C.
Note 6: Times shown are dwell times. Temperatures shown are dwell temperatures. For detailed information on soldering plastic small-outline packages, refer to the
Packaging Databook available from National Semiconductor Corporation.
Note 7: For testing purposes, ESD was applied using the human-body model, a 100 pF capacitor discharged through a 1.5 k
Ω resistor.
Note 8: As with the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. The 300 mW rating
appearing under Operating Ratings results from substituting the maximum junction temperature for operation, 125˚C, for TJ, 50˚C for TA, and 250˚C/W for θJA in
P = (TJ −TA)/θJA. More power can be dissipated at lower ambient temperatures. Less power can be dissipated at higher ambient temperatures. The maximum power
dissipation for operation appearing under Operating Ratings can be increased by 4 mW for each ˚C below 50˚C ambient. It must be derated by 4 mW for each ˚C
above 50˚C ambient. A
θJA of 250˚C/W represents the worst-case condition of no heat sinking of the 5-lead plastic SOT-23 package. Heat sinking enables the dis-
sipation of more power during operation.
www.national.com
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