ISO7821LLDWWR datasheet(5/33 Pages) TI1

Part #	ISO7821LLDWWR

Description	High-Performance, 8000-VPK Reinforced Isolated Dual-LVDS Buffer

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Manufacturer	TI1 [Texas Instruments]

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5

ISO7820LL, ISO7821LL

www.ti.com

SLLSET8A – MARCH 2016 – REVISED AUGUST 2016

Product Folder Links: ISO7820LL ISO7821LL

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

ISO7820LL

ISO7821LL

UNIT

DW (SOIC)

DWW (SOIC)

16 PINS

RθJA

Junction-to-ambient thermal resistance

82

84.6

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

44.6

46.4

°C/W

RθJB

Junction-to-board thermal resistance

46.6

55.3

°C/W

ψJT

Junction-to-top characterization parameter

17.8

18.7

°C/W

ψJB

Junction-to-board characterization parameter

46.1

54.5

°C/W

RθJC(bottom)

Junction-to-case(bottom) thermal resistance

—

°C/W

6.5 Power Ratings

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 5 pF, input a 50-MHz 50% duty-cycle square wave, EN1 = EN2 = 5.5 V,

RL = 100-Ω differential

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO7821LL

PD

Maximum power dissipation (both sides)

156

mW

PD1

Maximum power dissipation (side 1)

78

mW

PD2

Maximum power dissipation (side 2)

78

mW

ISO7820LL

PD

Maximum power dissipation (both sides)

152

mW

PD1

Maximum power dissipation (side 1)

36

mW

PD2

Maximum power dissipation (side 2)

116

mW

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ISO7821LLDWWR Datasheet(PDF) 5 Page - Texas Instruments

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