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OPA388, OPA2388, OPA4388

www.ti.com

SBOS777 – DECEMBER 2016

Product Folder Links: OPA388 OPA2388 OPA4388

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Short-circuit to ground, one amplifier per package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

(V+) – (V–)

Single-supply

6

V

Dual-supply

±3

Signal input pins

Voltage

Common-mode

(V–) – 0.5

(V+) + 0.5

V

Differential

±0.5

Current

±10

mA

Continuous

Temperature

–55

150

°C

150

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±4000

V

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Single-supply

2.5

5.5

V

Dual-supply

±1.25

±2.75

Specified temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: OPA388

OPA388

UNIT

D (SOIC)

8 PINS

Junction-to-ambient thermal resistance

116

°C/W

Junction-to-case(top) thermal resistance

60

°C/W

Junction-to-board thermal resistance

56

°C/W

Junction-to-top characterization parameter

12.8

°C/W

Junction-to-board characterization parameter

55.9

°C/W

Junction-to-case(bottom) thermal resistance

N/A

°C/W