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OPAx388 Datasheet(PDF) 5 Page - Texas Instruments |
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OPAx388 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 32 page 5 OPA388, OPA2388, OPA4388 www.ti.com SBOS777 – DECEMBER 2016 Product Folder Links: OPA388 OPA2388 OPA4388 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Short-circuit to ground, one amplifier per package. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VS = (V+) – (V–) Single-supply 6 V Dual-supply ±3 Signal input pins Voltage Common-mode (V–) – 0.5 (V+) + 0.5 V Differential ±0.5 Current ±10 mA Output short circuit(2) Continuous Temperature Operating, TA –55 150 °C Junction, TJ 150 Storage, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage, VS = (V+) – (V–) Single-supply 2.5 5.5 V Dual-supply ±1.25 ±2.75 Specified temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information: OPA388 THERMAL METRIC(1) OPA388 UNIT D (SOIC) 8 PINS RθJA Junction-to-ambient thermal resistance 116 °C/W RθJC(top) Junction-to-case(top) thermal resistance 60 °C/W RθJB Junction-to-board thermal resistance 56 °C/W ψJT Junction-to-top characterization parameter 12.8 °C/W ψJB Junction-to-board characterization parameter 55.9 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A °C/W |
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