SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 8

8. SOLDERING

c) Never contact the ceramic with the iron tip

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

d) 1.0mm tip diameter (max)

f) Limit soldering time to 4~5 secs.

8-1.2 Soldering Iron (Figure 2) :

In the event that a soldering iron must be employed the following precautions are recommended.

Products attachment with soldering iron is discouraged due to the inherent process control limitations.

Recommended temperature profiles for re-flow soldering in Figure 1.

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all

re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air

a) Preheat circuit and products to 150°C.

soldering tools.

8-1.1 Solder Re-flow :

Note :

b) 355°C tip temperature (max)

Over 1min.

Gradual

Cooling

Within 4-5s

350

150

Preheating

Soldering

cooling

Natural

Time(sec.)

60~150s

20~40s

Soldering

480s max.

60~180s

150

25

TP(260°C/40s max.)

217

200

Preheating

cooling

Natural

Figure 1. Re-flow Soldering: 3 times max.

Figure 2. Hand Soldering: 1 times max.

SMD Power Choke Coil

NOTE : Specifications subject to change without notice. Please check our website for latest information.

05.11.2015

PIC1265HP SERIES