Proprietary and Confidential

Document of Superworld

25/04/2016

P3

7. Soldering

7-1: Soldering

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the

stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our

terminations are suitable for all re-flow soldering systems. If hand soldering cannot be avoided, the

preferred technique is the utilization of hot air soldering tools.

Note:

-If wave soldering is used, there will be some risk.

-Reflow soldering temperatures below 240°C, there will be non-wetting risk.

7-2: Solder Re-flow:

Recommended temperature profiles for re-flow soldering in Figure 1

7-3: Soldering Iron (Figure 2):

Products attachment with soldering iron is discouraged due to the inherent process control limitations.

In the event that a soldering iron must be employed the following precautions are recommended.

Note:

a) Preheat circuit and products to 150°C

b) 355°C tip temperature (Max.)

c) Never contact the ceramic with the iron tip

d) 1.0mm tip diameter (Max.)

e) Use a 20watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 4-5 sec