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MC14106B Datasheet(PDF) 1 Page - ON Semiconductor

Part No. MC14106B
Description  Hex Schmitt Trigger
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC14106B Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 10
1
Publication Order Number:
MC14106B/D
MC14106B
Hex Schmitt Trigger
The MC14106B hex Schmitt Trigger is constructed with MOS
P−channel and N−channel enhancement mode devices in a single
monolithic structure. These devices find primary use where low power
dissipation and/or high noise immunity is desired. The MC14106B
may be used in place of the MC14069UB hex inverter for enhanced
noise immunity or to “square up” slowly changing waveforms.
This device contains protection circuitry to guard against damage
due to high static voltages or electric fields. However, precautions
must be taken to avoid applications of any voltage higher than
maximum rated voltages to this high−impedance circuit. For proper
operation, Vin and Vout should be constrained to the range VSS
≤ (Vin
or Vout)
≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage
level (e.g., either VSS or VDD). Unused outputs must be left open.
Features
Increased Hysteresis Voltage Over the MC14584B
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low−power TTL Loads or One
Low−power Schottky TTL Load Over the Rated Temperature
Range
Pin−for−Pin Replacement for CD40106B and MM74C14
Can Be Used to Replace the MC14584B or MC14069UB
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
Parameter
Value
Unit
VDD
DC Supply Voltage Range
− 0.5 to +18.0
V
Vin, Vout
Input or Output Voltage Range
(DC or Transient)
− 0.5 to VDD + 0.5
V
Iin, Iout
Input or Output Current
(DC or Transient) per Pin
±10
mA
PD
Power Dissipation, per Package
(Note 1)
500
mW
TA
Ambient Temperature Range
− 55 to +125
°C
Tstg
Storage Temperature Range
− 65 to +150
°C
TL
Lead Temperature
(8−Second Soldering)
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Temperature Derating: “D/DW” Packages: –7.0 mW/
°C From 65°C To 125°C
http://onsemi.com
MARKING DIAGRAMS
SOIC−14 NB
TSSOP−14
1
14
14106BG
AWLYWW
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or
G = Pb−Free Package
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
14
106B
ALYW
G
G
1
14
(Note: Microdot may be in either location)
SOIC−14 NB
D SUFFIX
CASE 751A
TSSOP−14
DT SUFFIX
CASE 948G


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