Micrel, Inc.

SY89832U

Absolute Maximum Ratings

(4)

Input Current

Source or Sink Current on (IN, /IN) ....................±50mA

VREF-AC Current

Lead Temperature (soldering, 20s)............................ 260°C

Operating Ratings

(5)

Package Thermal Resistance

(6)

QFN

(

θ

(

Ψ

DC Electrical Characteristics

(7)

Symbol

Parameter

Condition

Min.

Typ.

Max.

Units

Power Supply

2.375

2.5

2.625

V

Power Supply Current

75

100

mA

Input Resistance (IN-to-VT)

45

50

55

Ω

Differential Input Resistance

(IN-to-/IN)

90

100

110

Ω

Input HIGH Voltage (IN, /IN)

0.1

V

Input LOW Voltage (IN, /IN)

−0.3

V

Input Voltage Swing (IN, /IN)

See Figure 4.

0.1

V

Differential Input Voltage Swing

|IN – /IN|

See Figure 5.

0.2

V

Input Current (IN, /IN)

Note 8

45

mA

Output Reference Voltage

V

Notes:

4.

Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied

at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended

periods may affect device reliability.

5.

The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

6.

Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB.

values are determined for a 4-layer board in still-air number, unless otherwise stated.

7.

The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.

8.

Due to the internal termination the input current depends on the applied voltages at IN, /IN and VT inputs. Do not apply a combination of voltages

that causes the input current to exceed the maximum limit!

September 10, 2014

4

Revision 3.0

tcghelp@micrel.com or (408) 955-1690