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SY89833LMGTR Datasheet(PDF) 4 Page - Micrel Semiconductor |
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SY89833LMGTR Datasheet(HTML) 4 Page - Micrel Semiconductor |
4 / 13 page Micrel, Inc. SY89833L Absolute Maximum Ratings (4) Supply Voltage (VCC) .................................... −0.5V to +4.0V Input Voltage (VIN) .................................. −0.5 to VCC +0.3V LVDS Output Current (IOUT).......................................+10mA Input Current Source or Sink Current on (IVT).............................±2mA Maximum Operating Junction Temperature............... 125°C Lead Temperature (Soldering, 20 s) .......................... 260°C Storage Temperature (TS)......................... −65°C to +150°C Operating Ratings (5) Supply Voltage Range ................................. +3.0V to +3.6V Ambient Temperature (TA) .......................... –40°C to +85°C Junction Thermal Resistance (6) QFN ( θJ A) Still-Air ...........................................................60°C/W QFN ( ΨJ B).......................................................... 33°C/W Electrical Characteristics (7) TA = −40°C to +85°C, unless otherwise stated. Symbol Parameter Condition Min. Typ. Max. Units VCC Power Supply Voltage Range 3.0 3.3 3.6 V ICC Power Supply Current No load, maximum VCC 75 100 mA RIN Input Resistance (IN-to-VT) 45 50 55 Ω RDIFF-IN Differential Input Resistance (IN-to-/IN) 90 100 110 Ω VIH Input HIGH Voltage (IN-to-/IN) 0.1 VCC + 0.3 V VIL Input LOW Voltage (IN-to-/IN) −0.3 VIH – 0.1 V VIN Input Voltage Swing (IN-to-/IN) Note 8, see Figure 4. 0.1 VCC V VDIFF_IN Differential Input Voltage Note 8, see Figure 5. 0.2 V |IIN| Input Current (IN, /IN) Note 8. 45 mA VREF-AC Reference Voltage VCC − 1.525 VCC − 1.425 VCC − 1.325 V Notes: 4. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 5. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 6. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. ψJB and θJA values are determined for a 4-layer board in still-air number, unless otherwise stated. 7. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 8. Due to the internal termination (see "Input Buffer Structure" section) the input current depends on the applied voltages at IN, /IN and VT inputs. Do not apply a combination of voltages that causes the input current to exceed the maximum limit. September 10, 2014 4 Revision 3.0 hbwhelp@micrel.com or (408) 955-1690 |
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