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HSDL3208 Datasheet(PDF) 8 Page - Agilent(Hewlett-Packard)

Part # HSDL3208
Description  Ultra Small Profile Package IrDA Data Compliant Low Power 115.2 kbit/s Infrared Transceiver
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Manufacturer  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HSDL3208 Datasheet(HTML) 8 Page - Agilent(Hewlett-Packard)

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8
Moisture Proof Packaging
All HSDL-3208 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
This part is compliant to JEDEC
Level 4.
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Package
Temp.
Time
In reels
60
°C
≥ 48 hours
In bulk
100
°C
≥ 4 hours
125
°C
≥ 2 hours
150
°C
≥ 1 hour
Baking should only be done once.
Recommended Storage Conditions
Storage
10
°C to 30°C
Temperature
Relative
below 60% RH
Humidity
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within
two days if stored at the recom-
mended storage conditions. If
times longer than 72 hours are
needed, the parts must be stored
in a dry box.
Figure 12. Baking conditions chart.
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
PACKAGE IS
OPENED (UNSEALED)
ENVIRONMENT
LESS THAN 30°C,
AND LESS THAN
60% RH
PACKAGE IS
OPENED LESS
THAN 72 HOURS
PERFORM RECOMMENDED
BAKING CONDITIONS
NO BAKING
IS NECESSARY
YES
NO
NO
YES


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