STM32F469BG datasheet(11/217 Pages) STMICROELECTRONICS

Part #	STM32F469BG

Description	ARMCortex-M4 32b MCUFPU, 225DMIPS, up to 2MB Flash/3844KB RAM, USB OTG HS/FS, Ethernet, FMC, dual Quad-SPI, Graphical accelerator, Camera IF, LCD-TFT & MIPI DSI

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STM32F469xx

List of figures

11

ultra fine pitch ball grid array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205

Figure 93.

UFBGA176+25 - 201-ball, 10 x 10 mm, 0.65 mm pitch, ultra fine pitch ball

grid array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206

Figure 94.

LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 207

Figure 95.

LQFP208 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209

Figure 96.

LQFP208 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210

Figure 97.

TFBGA216 - thin fine pitch ball grid array 13 × 13 × 0.8mm, package outline . . . . . . . . . 211

Figure 98.

TFBGA216 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212

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STMicroelectronics	STM32F469BG	3Mb / 220P	Arm짰Cortex짰-M4 32b MCUFPU, 225DMIPS, up to 2MB Flash/3844KB RAM, USB OTG HS/FS, Ethernet, FMC, dual Quad-SPI, Graphical accelerator, Camera IF, LCD-TFT & MIPI DSI May 2021

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