STM32F303XD datasheet(10/173 Pages) STMICROELECTRONICS

Part #	STM32F303XD

Description	ARM Cortex-M4 32b MCUFPU, up to 512KB Flash, 80KB SRAM, FSMC, 4 ADCs, 2 DAC ch., 7 comp, 4 Op-Amp, 2.0-3.6 V

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

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10 / 173 page

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STM32F303xD STM32F303xE

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Figure 45.

I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

Figure 46.

I2S master timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

Figure 47.

USB timings: definition of data signal rise and fall time . . . . . . . . . . . . . . . . . . . . . . . . . . 131

Figure 48.

ADC typical current consumption on VDDA pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

Figure 49.

ADC typical current consumption on VREF+ pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

Figure 50.

ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143

Figure 51.

Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144

Figure 52.

12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146

Figure 53.

OPAMP voltage noise versus frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150

Figure 54.

LQFP144 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

Figure 55.

Recommended footprint for the LQFP144 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154

Figure 56.

LQFP144 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155

Figure 57.

UFBGA100 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156

Figure 58.

Recommended footprint for the UFBGA100 package . . . . . . . . . . . . . . . . . . . . . . . . . . . 157

Figure 59.

UFBGA100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158

Figure 60.

LQFP100 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

Figure 61.

Recommended footprint for the LQFP100 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160

Figure 62.

LQFP100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

Figure 63.

WLCSP100 package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162

Figure 64.

Recommended footprint for the WLCSP100 package . . . . . . . . . . . . . . . . . . . . . . . . . . . 163

Figure 65.

WLCSP100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164

Figure 66.

LQFP64 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165

Figure 67.

Recommended footprint for the LQFP64 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166

Figure 68.

LQFP64 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167

Figure 69.

LQFP100 PD max vs. TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170

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