5

TMP421-Q1, TMP422-Q1, TMP423-Q1

www.ti.com

SBOS821 – NOVEMBER 2016

Product Folder Links: TMP421-Q1 TMP422-Q1 TMP423-Q1

Submit Documentation Feedback

Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

7

V

Input voltage

Pins 1, 2, 3, and 4 only

–0.5

V

Pins 6 and 7 only

–0.5

7

Input current

10

mA

Operational temperature

–55

127

°C

150

°C

–60

130

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±3000

V

Charged-device model (CDM), per AEC Q100-011

±750

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Temperature

–40

125

°C

Power-supply voltage

2.7

5.5

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TMP42x-Q1

UNIT

DCN (SOT-23)

8 PINS

Junction-to-ambient thermal resistance

147

°C/W

Junction-to-case (top) thermal resistance

115

°C/W

Junction-to-board thermal resistance

33

°C/W

Junction-to-top characterization parameter

38

°C/W

Junction-to-board characterization parameter

33

°C/W