1

VCC1

8

VCC2

2

SDA1

7

SDA2

3

SCL1

6

SCL2

4

GND1

5

GND2

Not to scale

Side 2

Side 1

4

ISO1540-Q1, ISO1541-Q1

SLLSEX0 – NOVEMBER 2016

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ISO1541-Q1 D Package

8-Pin SOIC

Top View

Pin Functions—ISO1541-Q1

PIN

I/O

DESCRIPTION

NAME

NO.

GND1

4

—

Ground, side 1

GND2

5

—

Ground, side 2

SCL1

3

I

Serial clock input, side 1

SCL2

6

O

Serial clock output, side 2

SDA1

2

I/O

Serial data input / output, side 1

SDA2

7

I/O

Serial data input / output, side 2

VCC1

1

—

Supply voltage, side 1

VCC2

8

—

Supply voltage, side 2

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values here within are with respect to the local ground pin (GND1 or GND2) and are peak voltage values.

(3)

Maximum voltage must not exceed 6 V.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Voltage

VCC1, VCC2

–0.5

6

V

SDA1, SCL1

–0.5

SDA2, SCL2

–0.5

Output current

SDA1, SCL1

–20

20

mA

SDA2, SCL2

–100

100

Maximum junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per AEC

All pins except bus pins

±4000

V

Bus pins

±8000

Charged-device model (CDM), per AEC Q100-011

±1500