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MS5803-02BA Datasheet(PDF) 18 Page - TE Connectivity Ltd
TEC [TE Connectivity Ltd]
MS5803-02BA Datasheet(HTML) 18 Page - TE Connectivity Ltd
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Miniature Altimeter Module
MOUNTING AND ASSEMBLY CONSIDERATIONS
Please refer to the application note AN808 available on our website for all soldering issues.
The MS5803-02BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be
damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It
is important to solder all contact pads.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB for interconnection. This can be important for
applications in watches and other special devices.
SEALING WITH O-RINGS
In products like outdoor watches the electronics must be protected against direct water or humidity. For those
products the MS5803-02BA provides the possibility to seal with an O-ring. The protective cap of the MS5803-02BA
is made of special anticorrosive stainless steel with a polished surface. In addition to this the MS5803-02BA is filled
with silicone gel covering the sensor and the bonding wires. The O-ring (or O-rings) shall be placed at the outer
diameter of the metal cap. This method avoids mechanical stress because the sensor can move in vertical direction.
The MS5803-02BA has been manufactured under cleanroom conditions. It is therefore recommended to assemble
the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the
sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of
type “no-clean” shall be used. Cleaning might damage the sensor!
The electrical contact pads are protected against ESD up to 4 kV HBM (human body model). It is therefore essential
to ground machines and personnel properly during assembly and handling of the device. The MS5803-02BA is
shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of
the sensor shall be of an equivalent antistatic material.
Particular care must be taken when connecting the device to the power supply. A 100 nF ceramic capacitor must
be placed as close as possible to the MS5803-02BA VDD pin. This capacitor will stabilize the power supply during
data conversion and thus, provide the highest possible accuracy.
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