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TSS461 Datasheet(PDF) 5 Page - TEMIC Semiconductors |
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TSS461 Datasheet(HTML) 5 Page - TEMIC Semiconductors |
5 / 24 page ![]() Qualpack TSS463 / TSS461C Rev. 2 – January 1999 5 3.2 Product Design Die size (TSS463) 11.15mm2 (3610µm*3280µm) Die size (TSS461C) 8.46mm2 (3480µm*2610µm) Logic Effective channel length 0.8µm Gate poly width 0.8µm Gate poly spacing 1.2µm Metal 1 width 1.3um Metal 1 spacing 1.5um Metal 2 width 1.6um Metal 2 spacing 1.6um Contact size 1.0µm Via size 1.4µm |